ESTC 2008.1
I am in Greenwich, London at the moment at the ESTC2008 (Electronics and System-Integration Technology conference). And I am going to enjoy three day of electrical engineering geekery at it’s finest.
I am starting now with a session on “Electronics Integration for Healthcare: Materials and Processes”by James Lee.
The first talk is on “Versatile low cost wafer-level packaging enabled by powderblasting“.
September 2nd, 2008 - Posted in Conferences, English, Geek Stuff, MEMS, Mobile Blogging | No Comments »