Conference Talks:
24c3 2007 – Introduction in MEMS
DTIP 2008 – Acoustically enhanced electroplating, preliminary findings.
ESTC 2008 – Modelling and experimental work on acoustically enhances electroplating of copper in high aspect ratio structures.
Aerospace Sensor Technologies – Ensuring Nanoscale Manufacturing Integrity 2011 - Agile health and usage monitoring microsystems – a case study
DTIP 2011 – Agile manufacturing of MEMS for aerospace.
Publications:
Megasonic Enhanced Electrodeposition - DTIP 2008 Proceedings April 9, 2008
Megasonic agitation for enhanced electrodeposition of copper - Microsystem Technologies – Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMSJune 2009
Influence of megasonic agitation on the electrodeposition of high aspect ratio blind via - IEEE ESTC 2008 Proceedings
Megasonic enhanced wafer bumping process to enable high density electronics interconnection – IEEE ESTC 2008September 1, 2008
Agile MEMS Packaging – An integrative design and manufacturing solution for mass customized MEMS products - DTIP 2011 Proceedings April 4, 2011